GENEVA, May 19 -- JAPAN AEROSPACE EXPLORATION AGENCY (7-44-1, Jindaiji Higashi-machi, Chofu-shi, Tokyo1828522), 国立研究開発法人宇宙航空研究開発機構 (東京都調布市深大寺東町七丁目４４番地１) filed a patent application (PCT/JP2024/039630) for "DRY BONDING METHOD FOR NON-THERMOPLASTIC RESINS AND SUBSTRATE FOR DRY BONDING" on Nov 07, 2024. With publication no. WO/2025/100491, the details related to the patent application was published on May 15, 2025.
Notably, the patent application was submitted under the International Paten...