INTERNATIONAL PATENT: INTERNATIONAL INNOVATION CENTER OF TSINGHUA UNIVERSITY, SHANGHAI, 上海清华国际创新中心, TSINGHUA UNIVERSITY, 清华大学 FILES APPLICATION FOR "INTERPOSER FOR MULTI-CHIP INTEGRATION AND CHIP INTEGRATION SYSTEM"

Posted On: 2026-02-20

GENEVA, Feb. 20 -- INTERNATIONAL INNOVATION CENTER OF TSINGHUA UNIVERSITY, SHANGHAI (5F, Building 4, 602 Tongpu RoadPutuo District, Shanghai 200062), 上海清华国际创新中心 (中国上海市普陀区同普路602号4号楼5楼), TSINGHUA UNIVERSITY (Qinghua Yuan,Haidian District, Beijing 100084), 清华大学 (中国北京市海淀区清华园) filed a patent application (PCT/CN2024/126044) for "INTERPOSER FOR MULTI-CHIP INTEGRATION AND CHIP INTEGRATION SYSTEM" on Oct 21, 2024. With publication no. WO/2026/036513, the details related to t...

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INTERNATIONAL PATENT: INTERNATIONAL INNOVATION CENTER OF TSINGHUA UNIVERSITY, SHANGHAI, 上海清华国际创新中心, TSINGHUA UNIVERSITY, 清华大学 FILES APPLICATION FOR "INTERPOSER FOR MULTI-CHIP INTEGRATION AND CHIP INTEGRATION SYSTEM"