INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM UNITED KINGDOM LIMITED FILES APPLICATION FOR "AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA"

GENEVA, April 28 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonkNew York, 10504), IBM UNITED KINGDOM LIMITED (PO Box 41, North HarbourPortsmouth Hampshire PO6 3AU) filed a patent application (PCT/EP2024/075394) for "AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA" on Sep 11, 2024. With publication no. WO/2025/082669, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DUTTA, Ashim (IBM CORPORATION257 FULLER ROADALBANY, New York 12203-3654), LUEDDERS, Katherine (IBM CORPORATION257 FULLER ROADALBANY, New Y...