INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM UNITED KINGDOM LIMITED, IBM (CHINA) COMPANY LIMITED FILES APPLICATION FOR "THERMOELECTRIC COOLING STRUCTURE AT HYBRID BONDING INTERFACE"

GENEVA, Oct. 19 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM UNITED KINGDOM LIMITED (Building CIBM Hursley OfficeHursley Park RoadWinchester, Hampshire SO21 2JN), IBM (CHINA) COMPANY LIMITED (1F, Building A1No. 55 Lane, Chuan He RoadPudong New DistrictShanghai 201203) filed a patent application (PCT/IB2025/052634) for "THERMOELECTRIC COOLING STRUCTURE AT HYBRID BONDING INTERFACE" on Mar 12, 2025. With publication no. WO/2025/215436, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invento...