GENEVA, Nov. 3 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM UNITED KINGDOM LIMITED (Building CIBM Hursley OfficeHursley Park RoadWinchester, Hampshire SO21 2JN), IBM (CHINA) COMPANY LIMITED (1F, Building A1, No. 55 Lane, Chuan He Road, Pudong New DistrictShanghai 201203) filed a patent application (PCT/IB2025/053932) for "HETEROGENEOUS HYBRID BONDING" on Apr 15, 2025. With publication no. WO/2025/224560, the details related to the patent application was published on Oct 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): FOKAS, Nikiforos (IBM C...