INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "SILICON INTERPOSER WITH INTEGRATED FINE-PITCH WAFER TEST PROBES"

GENEVA, Feb. 8 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/EP2025/070778) for "SILICON INTERPOSER WITH INTEGRATED FINE-PITCH WAFER TEST PROBES" on Jul 21, 2025. With publication no. WO/2026/027288, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AUDETTE, David Michael (c/o IBM Corporation19 Thompson DriveEssex Junction, Vermont 05452), FIELDSEND, Christopher Michael (c/o IBM Corporation19...