INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "CONNECTIONS BETWEEN DIAGONALLY OPPOSITE INTEGRATED CIRCUITS IN A MULTI-CHIP MODULE TO REDUCE NUMBER OF ROUTING LAYERS"

GENEVA, Sept. 16 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/EP2025/054709) for "CONNECTIONS BETWEEN DIAGONALLY OPPOSITE INTEGRATED CIRCUITS IN A MULTI-CHIP MODULE TO REDUCE NUMBER OF ROUTING LAYERS" on Feb 21, 2025. With publication no. WO/2025/186014, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SCHNEIDER, David (c/o IBM Deutschland Research & Development GmbHSchoenaicher Strasse 220...