INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM (CHINA) COMPANY LIMITED, IBM ISRAEL - SCIENCE & TECHNOLOGY LTD. FILES APPLICATION FOR "THROUGH DIELECTRIC VIA"

GENEVA, Nov. 17 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM (CHINA) COMPANY LIMITED (1F, Building A1, No. 55 Lane, Chuan He Road, Pudong New DistrictShanghai, Shanghai 201203), IBM ISRAEL - SCIENCE & TECHNOLOGY LTD. (Haifa University Campus165 Aba Khoushy AveMount Carmel3498825 Haifa) filed a patent application (PCT/IB2025/053967) for "THROUGH DIELECTRIC VIA" on Apr 15, 2025. With publication no. WO/2025/233718, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZOU, Lijuan (I...