INTERNATIONAL PATENT: INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES, 广东省科学院半导体研究所 FILES APPLICATION FOR "HIGH-DENSITY INTERCONNECTED PACKAGING STRUCTURE AND METHOD FOR CHIPS"

GENEVA, Feb. 24 -- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES (363 Changxing Road, Tianhe DistrictGuangzhou, Guangdong 510650), 广东省科学院半导体研究所 (中国广东省广州市天河区长兴路363号) filed a patent application (PCT/CN2023/113577) for "HIGH-DENSITY INTERCONNECTED PACKAGING STRUCTURE AND METHOD FOR CHIPS" on Aug 17, 2023. With publication no. WO/2025/035459, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the...