INTERNATIONAL PATENT: IHI CORPORATION, 株式会社ＩＨＩ, OSAKA UNIVERSITY, 国立大学法人大阪大学 FILES APPLICATION FOR "WELDED JOINT, WELDED STRUCTURE AND WELDING METHOD"

GENEVA, April 7 -- IHI CORPORATION (1-1, Toyosu 3-chome, Koto-ku, Tokyo1358710), 株式会社ＩＨＩ (東京都江東区豊洲三丁目１番１号), OSAKA UNIVERSITY (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号) filed a patent application (PCT/JP2024/029930) for "WELDED JOINT, WELDED STRUCTURE, AND WELDING METHOD" on Aug 23, 2024. With publication no. WO/2025/069817, the details related to the patent application was published on Apr 03, 2025.

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