INTERNATIONAL PATENT: IHI CORPORATION, 株式会社ＩＨＩ, IHI AEROSPACE CO., LTD., 株式会社ＩＨＩエアロスペース FILES APPLICATION FOR "WELDING DEVICE"

GENEVA, May 13 -- IHI CORPORATION (1-1, Toyosu 3-chome, Koto-ku, Tokyo1358710), 株式会社ＩＨＩ (東京都江東区豊洲三丁目１番１号), IHI AEROSPACE CO., LTD. (900 Fujiki, Tomioka-shi, Gunma3702398), 株式会社ＩＨＩエアロスペース (群馬県富岡市藤木９００番地) filed a patent application (PCT/JP2024/038693) for "WELDING DEVICE" on Oct 30, 2024. With publication no. WO/2025/094994, the details related to the patent application was published on May 08, 2025.

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