GENEVA, April 15 -- IHI AEROSPACE CO., LTD. (900 Fujiki, Tomioka-shi, Gunma3702398), 株式会社ＩＨＩエアロスペース (群馬県富岡市藤木９００番地) filed a patent application (PCT/JP2023/036407) for "FRP MOLDING MOLD, AND FRP MOLDING SYSTEM AND METHOD USING SAME" on Oct 05, 2023. With publication no. WO/2025/074585, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): AKIM...