GENEVA, Feb. 17 -- IDEMITSU FINE COMPOSITES CO., LTD. (8-1, Higashiueno 4-chome, Taito-ku, Tokyo1100015), 出光ファインコンポジット株式会社 (東京都台東区東上野四丁目８番１号) filed a patent application (PCT/JP2024/026581) for "RESIN COMPOSITION, COATING MATERIAL OR INSULATING MATERIAL, AND MOLDED BODY" on Jul 25, 2024. With publication no. WO/2025/033191, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed ...