GENEVA, Aug. 17 -- HUIKE (SINGAPORE) HOLDING PTE. LTD. (51 Science Park Road, #04-22, The AriesSingapore 117586), 汇科（新加坡）控股私人有限公司 (新加坡科技园路51号白羊座大厦#04-22) filed a patent application (PCT/CN2024/076984) for "BONDING STRUCTURE OF ULTRASONIC FINGERPRINT MODULE, DISPLAY APPARATUS, AND ELECTRONIC DEVICE" on Feb 08, 2024. With publication no. WO/2025/166745, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed...