INTERNATIONAL PATENT: HUANGPU INSTITUTE OF MATERIALS, 广东粤港澳大湾区黄埔材料研究院 FILES APPLICATION FOR "MODIFIED DICYANDIAMIDE CURING AGENT, PREPARATION METHOD THEREFOR AND USE THEREOF"

GENEVA, Nov. 2 -- HUANGPU INSTITUTE OF MATERIALS (No.388, Lianyun Road, Huangpu DistrictGuangzhou, Guangdong 510530), 广东粤港澳大湾区黄埔材料研究院 (中国广东省广州市黄埔区连云路388号) filed a patent application (PCT/CN2024/106280) for "MODIFIED DICYANDIAMIDE CURING AGENT, PREPARATION METHOD THEREFOR AND USE THEREOF" on Jul 18, 2024. With publication no. WO/2025/222649, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...