GENEVA, Feb. 17 -- HPSP CO., LTD. (26, Samsung 1-ro 1-gil,Hwaseong-si,Gyeonggi-do 18449), 주식회사 에이치피에스피 (경기도화성시삼성1로1길 26) filed a patent application (PCT/KR2024/009900) for "HIGH-PRESSURE SUBSTRATE PROCESSING APPARATUS" on Jul 11, 2024. With publication no. WO/2025/033736, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YOON, Hyeseong (26, Samsung 1-ro 1-gil,Hwaseong-si,Gyeonggi...