INTERNATIONAL PATENT: HOYA CORPORATION, ＨＯＹＡ株式会社 FILES APPLICATION FOR "ULTRASONIC CONNECTOR, ENDOSCOPE AND ENDOSCOPE SYSTEM"

GENEVA, Jan. 6 -- HOYA CORPORATION (6-10-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo1608347), ＨＯＹＡ株式会社 (東京都新宿区西新宿六丁目１０番１号) filed a patent application (PCT/JP2025/019460) for "ULTRASONIC CONNECTOR, ENDOSCOPE, AND ENDOSCOPE SYSTEM" on May 29, 2025. With publication no. WO/2026/004467, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HISAMATSU, Kozo (c/o HOYA ...