GENEVA, July 3 -- HOSIDEN CORPORATION (4-33, Kitakyuhoji 1-chome, Yao-shi, Osaka5810071), ホシデン株式会社 (大阪府八尾市北久宝寺一丁目４番３３号) filed a patent application (PCT/JP2024/039558) for "DISASSEMBLY JIG" on Nov 07, 2024. With publication no. WO/2025/134571, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IWAKI Toshikazu (c/o HOSIDEN CORPORATION, 4-33, Kitaky...