GENEVA, April 28 -- HOSIDEN CORPORATION (4-33, Kitakyuhoji 1-chome, Yao-shi, Osaka5810071), ホシデン株式会社 (大阪府八尾市北久宝寺１丁目４番３３号) filed a patent application (PCT/JP2024/029731) for "CONNECTOR, MODULE" on Aug 22, 2024. With publication no. WO/2025/083996, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SATO, Eiji (c/o HOSIDEN CORPORATION, 4-33, Kitakyu...