GENEVA, April 7 -- HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. (1-5-1, Sotokanda, Chiyoda-ku, Tokyo1010021), 株式会社日立産機システム (東京都千代田区外神田一丁目５番１号) filed a patent application (PCT/JP2024/024565) for "MOLD RESIN FOR POWER RECEIVING AND DISTRIBUTING DEVICES, POWER RECEIVING AND DISTRIBUTING DEVICE, AND METHOD FOR MANUFACTURING POWER RECEIVING AND DISTRIBUTING DEVICE" on Jul 08, 2024. With publication no. WO/2025/069637, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted unde...