GENEVA, Aug. 11 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目１７番１号) filed a patent application (PCT/JP2024/002558) for "WAFER TREATMENT METHOD" on Jan 29, 2024. With publication no. WO/2025/163694, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IMAMURA, Tsubasa (c/o HITACHI, Ltd.,...