INTERNATIONAL PATENT: HITACHI HIGH-TECH CORPORATION, 株式会社日立ハイテク FILES APPLICATION FOR "FINE PARTICLE FILLING METHOD AND FINE PARTICLE FILLING SYSTEM"

GENEVA, June 24 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目１７番１号) filed a patent application (PCT/JP2024/031904) for "FINE PARTICLE FILLING METHOD AND FINE PARTICLE FILLING SYSTEM" on Sep 05, 2024. With publication no. WO/2025/126595, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s...