INTERNATIONAL PATENT: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., 青岛海信宽带多媒体技术有限公司 FILES APPLICATION FOR "LASER CHIP FABRICATION METHOD, LASER CHIP AND OPTICAL MODULE"

GENEVA, Oct. 18 -- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD. (No.218 Qianwangang Road, Economic And Technical Development ZoneQingdao, Shandong 266555), 青岛海信宽带多媒体技术有限公司 (中国山东省青岛市经济技术开发区前湾港路218号) filed a patent application (PCT/CN2024/098473) for "LASER CHIP FABRICATION METHOD, LASER CHIP AND OPTICAL MODULE" on Jun 11, 2024. With publication no. WO/2025/213566, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under th...