GENEVA, Oct. 4 -- HIRATA CORPORATION (111 Hitotsugi, Ueki-machi, Kita-ku, Kumamoto-shi, Kumamoto8610198), 平田機工株式会社 (熊本県熊本市北区植木町一木１１１) filed a patent application (PCT/JP2024/011781) for "FORMING DEVICE AND FORMING METHOD" on Mar 25, 2024. With publication no. WO/2025/203195, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TAYAMA, Tatsuya (c/o HIRATA CORPORAT...