GENEVA, Sept. 16 -- HILLTOP CORPORATION (1-30, Narite, Okubo-cho, Uji-shi, Kyoto6110033), ＨＩＬＬＴＯＰ株式会社 (京都府宇治市大久保町成手１番地３０号) filed a patent application (PCT/JP2025/001670) for "APPARATUS AND METHOD FOR MANUFACTURING THIN ALLOY RIBBON" on Jan 21, 2025. With publication no. WO/2025/187227, the details related to the patent application was published on Sep 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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