INTERNATIONAL PATENT: HI-STEN CO.,LTD, 주식회사 하이스텐 FILES APPLICATION FOR "PIPING CLAMP TO WHICH PACKING IS COUPLED"

GENEVA, Feb. 17 -- HI-STEN CO.,LTD (113-79, Seobu-ro 1499beon-gil, Juchon-myeonGimhae-siGyeongsangnam-do 50877), 주식회사 하이스텐 (경상남도김해시주촌면 서부로1499번길 113-79) filed a patent application (PCT/KR2024/001844) for "PIPING CLAMP TO WHICH PACKING IS COUPLED" on Feb 07, 2024. With publication no. WO/2025/033628, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Kuk Jin (114...