INTERNATIONAL PATENT: HESAI TECHNOLOGY CO., LTD., 上海禾赛科技有限公司 FILES APPLICATION FOR "OPTICAL BEAM COMBINER AND MANUFACTURING METHOD THEREFOR, OPTICAL CHIP, TRANSCEIVING APPARATUS AND LIDAR"

GENEVA, March 8 -- HESAI TECHNOLOGY CO., LTD. (No. 3188, Baoqian HighwayJiading District, Shanghai 201815), 上海禾赛科技有限公司 (中国上海市嘉定区宝钱公路3188号) filed a patent application (PCT/CN2024/115306) for "OPTICAL BEAM COMBINER AND MANUFACTURING METHOD THEREFOR, OPTICAL CHIP, TRANSCEIVING APPARATUS AND LIDAR" on Aug 28, 2024. With publication no. WO/2025/045119, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Org...