GENEVA, Feb. 15 -- HENGDIAN GROUP DMEGC MAGNETICS CO., LTD. (Hengdian Industrial Area, DongyangJinhua, Zhejiang 322118), 横店集团东磁股份有限公司 (中国浙江省金华市东阳市横店工业区) filed a patent application (PCT/CN2023/127140) for "SILICON WAFER TEXTURING METHOD, TEXTURED SILICON WAFER, CRYSTALLINE SILICON CELL AND MANUFACTURING METHOD THEREFOR" on Oct 27, 2023. With publication no. WO/2025/030669, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sys...