GENEVA, Sept. 19 -- HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (No. 48, Xiyuan Road, Jianxi DistrictLuoyang, Henan 471000), 河南科技大学 (中国河南省洛阳市涧西区西苑路48号) filed a patent application (PCT/CN2024/092968) for "PREPARATION PROCESS OF HIGH-DENSITY TUNGSTEN-COPPER ALLOY" on May 14, 2024. With publication no. WO/2025/189542, the details related to the patent application was published on Sep 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WEI, Shizhong (N...