GENEVA, March 17 -- HEMICELLULOSE LTD. (7-7, Shinkawasaki, Saiwai-ku, Kawasaki-shi, Kanagawa2120032), 株式会社ヘミセルロース (神奈川県川崎市幸区新川崎７－７) filed a patent application (PCT/JP2024/031454) for "RESIN COMPOSITION EXCELLENT IN TRANSPARENCY AND MOLDED ARTICLE THEREOF" on Sep 02, 2024. With publication no. WO/2025/053103, the details related to the patent application was published on Mar 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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