GENEVA, June 23 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2023/044504) for "RESIN COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, CURED PRODUCT, AND ELECTRONIC COMPONENT" on Dec 12, 2023. With publication no. WO/2025/126337, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wor...