GENEVA, Sept. 9 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2024/007645) for "PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT" on Feb 29, 2024. With publication no. WO/2025/182050, the details related to the patent application was published on Sep 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC)...