GENEVA, May 5 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2023/038995) for "PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED PRODUCT, PRODUCTION METHOD FOR PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT" on Oct 27, 2023. With publication no. WO/2025/088815, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) s...