GENEVA, May 18 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2023/040303) for "PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT" on Nov 08, 2023. With publication no. WO/2025/099883, the details related to the patent application was published on May 15, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) s...