GENEVA, May 13 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2024/037067) for "INSULATING FILM FORMING MATERIAL, INSULATING FILM FORMING MATERIAL KIT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE" on Oct 17, 2024. With publication no. WO/2025/094691, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classifi...