INTERNATIONAL PATENT: HANZAWA, NOBUKAZU, 半澤 薫和 FILES APPLICATION FOR "BASE ISOLATION PACKING UNDER WOODEN SILL AND BASE ISOLATION MECHANISM FOR BUILDING PROVIDED WITH SAID BASE ISOLATION PACKING"

GENEVA, March 17 -- HANZAWA, Nobukazu (C/O SMRC Corporation, 5-39-11-306 Narita-higashi, Suginami-ku, Tokyo1660015), 半澤　薫和 (東京都杉並区成田東５－３９－１１－３０６　ＳＭＲＣ株式会社内) filed a patent application (PCT/JP2024/009333) for "BASE ISOLATION PACKING UNDER WOODEN SILL AND BASE ISOLATION MECHANISM FOR BUILDING PROVIDED WITH SAID BASE ISOLATION PACKING" on Mar 11, 2024. With publication no. WO/2025/052700, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was sub...