GENEVA, Oct. 5 -- HANWHA PRECISION MACHINERY CO., LTD. (84, Jeongdong-ro Seongsan-guChangwon-siGyeongsangnam-do 51552), 한화정밀기계 주식회사 (경상남도창원시성산구 정동로 84) filed a patent application (PCT/KR2024/020939) for "DIE BONDING APPARATUS" on Dec 23, 2024. With publication no. WO/2025/206525, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WOO, Hee Chan (84, Jeongdong-roSeongs...