INTERNATIONAL PATENT: HANGZHOU YICI CHENGPIN TECHNOLOGY CO., LTD., 杭州壹次诚品科技有限公司 FILES APPLICATION FOR "PACKAGING LID AND PACKAGING CONTAINER"

GENEVA, Nov. 23 -- HANGZHOU YICI CHENGPIN TECHNOLOGY CO., LTD. (Room 404, Building 1, Baojin Future Commercial Center, Cangqian Street, Yuhang DistrictHangzhou, Zhejiang 311121), 杭州壹次诚品科技有限公司 (中国浙江省杭州市余杭区仓前街道宝晋未来商业中心1幢404室) filed a patent application (PCT/CN2024/094467) for "PACKAGING LID AND PACKAGING CONTAINER" on May 21, 2024. With publication no. WO/2025/236312, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitte...