INTERNATIONAL PATENT: HANGZHOU HIKMICRO SENSING TECHNOLOGY CO., LTD., 杭州海康微影传感科技有限公司 FILES APPLICATION FOR "DEWAR ASSEMBLY AND MACHINING METHOD THEREFOR AND DETECTION DEVICE"

GENEVA, March 24 -- HANGZHOU HIKMICRO SENSING TECHNOLOGY CO., LTD. (Building A1, No. 299, Qiushi Road, Tonglu Economic Development Zone, TongluHangzhou, Zhejiang 311501), 杭州海康微影传感科技有限公司 (中国浙江省杭州市桐庐县桐庐经济开发区求是路299号A1号楼) filed a patent application (PCT/CN2024/117944) for "DEWAR ASSEMBLY AND MACHINING METHOD THEREFOR, AND DETECTION DEVICE" on Sep 10, 2024. With publication no. WO/2025/055884, the details related to the patent application was published on Mar 20, 2025.

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