GENEVA, March 23 -- HANGZHOU DIANZI UNIVERSITY (1158 2nd Street, Xiasha Higher Education ParkHangzhou, Zhejiang 310018), 杭州电子科技大学 (中国浙江省杭州市下沙高教园区2号大街1158号) filed a patent application (PCT/CN2024/091104) for "METHOD FOR MEASURING THICKNESS OF ADHESIVE LAYER OF BONDED STIFFENED STRUCTURE ON THE BASIS OF ATTENUATION CHARACTERISTICS OF FEATURE GUIDED WAVE" on May 06, 2024. With publication no. WO/2025/055348, the details related to the patent application was published on Mar 20, 2025.
Notably, the patent application was submitted under the International Patent Clas...