GENEVA, May 11 -- HANGZHOU BING JIA TECHNOLOGY CO., LTD. (Room 702, Block 11, No. 1818-2, Wenyi West Road, Yuhang Street, Yuhang DistrictHangzhou, Zhejiang 311100), 杭州丙甲科技有限公司 (中国浙江省杭州市余杭区余杭街道文一西路1818-2号11幢702室) filed a patent application (PCT/CN2024/127755) for "PAPER PADDING AND FORMING METHOD THEREFOR" on Oct 28, 2024. With publication no. WO/2025/092655, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classifica...