GENEVA, March 31 -- HAMAMATSU PHOTONICS K.K. (1126-1, Ichino-cho, Chuo-ku, Hamamatsu-shi, Shizuoka4358558), 浜松ホトニクス株式会社 (静岡県浜松市中央区市野町１１２６番地の１) filed a patent application (PCT/JP2024/020543) for "PRELIMINARY SOLDER FORMING METHOD AND PRELIMINARY SOLDER FORMING DEVICE" on Jun 05, 2024. With publication no. WO/2025/062759, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wor...