INTERNATIONAL PATENT: GUANGDONG INSTITUTE OF ARTIFICIAL INTELLIGENCE AND ADVANCED COMPUTING, 广东人工智能与先进计算研究院, CHIP-HOP TECHNOLOGY (GUANGZHOU) CO., LTD., 芯跳科技（广州）有限公司 FILES APPLICATION FOR "PLASTIC PACKAGING MOLD FOR CONTACT FORCE SENSORS AND PLASTIC PACKAGING METHOD"

GENEVA, May 25 -- GUANGDONG INSTITUTE OF ARTIFICIAL INTELLIGENCE AND ADVANCED COMPUTING (Room 801, Building B2, No. 11 Kaiyuan Avenue, Huangpu DistrictGuangzhou, Guangdong 510530), 广东人工智能与先进计算研究院 (中国广东省广州市黄埔区开源大道11号B2栋801室), CHIP-HOP TECHNOLOGY (GUANGZHOU) CO., LTD. (Room 801, Building B2, No. 11 Kaiyuan Avenue, Huangpu DistrictGuangzhou, Guangdong 510530), 芯跳科技（广州）有限公司 (中国广东省广州市(...