INTERNATIONAL PATENT: GUANGDONG GREATER BAY AREA INSTITUTE OF INTEGRATED CIRCUIT AND SYSTEM, 广东省大湾区集成电路与系统应用研究院 FILES APPLICATION FOR "INGAAS WAFER AND MANUFACTURING METHOD THEREFOR AND RADIO FREQUENCY ARRAY CHIP AND MANUFACTURING METHOD THEREFOR"

GENEVA, July 7 -- GUANGDONG GREATER BAY AREA INSTITUTE OF INTEGRATED CIRCUIT AND SYSTEM (Building A, No.136 Kaiyuan Avenue, Guangzhou Development ZoneGuangzhou, Guangdong 510535), 广东省大湾区集成电路与系统应用研究院 (中国广东省广州市广州开发区开源大道136号A栋) filed a patent application (PCT/CN2024/130408) for "INGAAS WAFER AND MANUFACTURING METHOD THEREFOR, AND RADIO FREQUENCY ARRAY CHIP AND MANUFACTURING METHOD THEREFOR" on Nov 07, 2024. With publication no. WO/2025/139385, the details related to the patent application ...