INTERNATIONAL PATENT: GLOBALWAFERS JAPAN CO., LTD., グローバルウェーハズ・ジャパン株式会社 FILES APPLICATION FOR "SILICON WAFER CLEANING METHOD"

GENEVA, May 18 -- GLOBALWAFERS JAPAN CO., LTD. (6-861-5, Higashiko, Seiro-machi, Kitakanbara-gun, Niigata9570197), グローバルウェーハズ・ジャパン株式会社 (新潟県北蒲原郡聖籠町東港六丁目８６１番地の５) filed a patent application (PCT/JP2024/020626) for "SILICON WAFER CLEANING METHOD" on Jun 06, 2024. With publication no. WO/2025/099975, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classificat...