INTERNATIONAL PATENT: GLOBALWAFERS JAPAN CO., LTD., グローバルウェーハズ・ジャパン株式会社 FILES APPLICATION FOR "METHOD FOR MANUFACTURING SILICON WAFER"

GENEVA, Oct. 5 -- GLOBALWAFERS JAPAN CO., LTD. (6-861-5, Higashiko, Seiro-machi, Kitakanbara-gun Niigata9570197), グローバルウェーハズ・ジャパン株式会社 (新潟県北蒲原郡聖籠町東港六丁目８６１番地の５) filed a patent application (PCT/JP2025/007629) for "METHOD FOR MANUFACTURING SILICON WAFER" on Mar 04, 2025. With publication no. WO/2025/204557, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Cla...