GENEVA, Oct. 12 -- GLASSMICRO (CHONGQING) SEMICONDUCTOR TECHNOLOGY CO., LTD. (No.32 Taibai Avenue, Fuling DistrictChongqing 408000), 玻芯成（重庆）半导体科技有限公司 (中国重庆市涪陵区太白大道32号) filed a patent application (PCT/CN2024/085864) for "STACKED CHIP AND MANUFACTURING METHOD THEREFOR, MANUFACTURING METHOD FOR CIRCUIT UNIT, AND STACKED SUBSTRATE" on Apr 03, 2024. With publication no. WO/2025/208417, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classifi...