INTERNATIONAL PATENT: GENEUS TECHNOLOGIES (CHENGDU) CO., LTD., 成都今是科技有限公司, DALIAN CHIP MATERIALS & THIN FILM TECHNOLOGY CO., LTD., 大连芯材薄膜技术有限公司 FILES APPLICATION FOR "METAL-DOPED SUPERCAPACITOR MICROELECTRODE AND PREPARATION METHOD THEREFOR AND BIOCHIP"

Posted On: 2025-08-04

GENEVA, Aug. 4 -- GENEUS TECHNOLOGIES (CHENGDU) CO., LTD. (Room 601, 605, 6th Floor, Building 12, No.88 Keyuan South Road, High-tech ZoneChengdu, Sichuan 610041), 成都今是科技有限公司 (中国四川省成都市高新区科园南路88号12栋6层601、605号), DALIAN CHIP MATERIALS & THIN FILM TECHNOLOGY CO., LTD. (Room 501, No. 56-2 Huoju Road, High-tech ZoneDalian, Liaoning 116085), 大连芯材薄膜技术有限公司 (中国辽宁省大连市高新园区火&#...

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INTERNATIONAL PATENT: GENEUS TECHNOLOGIES (CHENGDU) CO., LTD., 成都今是科技有限公司, DALIAN CHIP MATERIALS & THIN FILM TECHNOLOGY CO., LTD., 大连芯材薄膜技术有限公司 FILES APPLICATION FOR "METAL-DOPED SUPERCAPACITOR MICROELECTRODE AND PREPARATION METHOD THEREFOR AND BIOCHIP"