GENEVA, Oct. 5 -- FURUKAWA ELECTRIC CO., LTD. (6-4, Otemachi 2-chome, Chiyoda-ku, Tokyo1008322), 古河電気工業株式会社 (東京都千代田区大手町二丁目６番４号) filed a patent application (PCT/JP2025/011837) for "FILM-LIKE ADHESIVE, COMPOSITION FOR ADHESIVE, DICING-DIE ATTACHMENT FILM, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Mar 25, 2025. With publication no. WO/2025/205832, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) sy...