INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "RESIN COMPOSITION AND METHOD FOR PRODUCING INTERLAYER DIELECTRIC FOR REDISTRIBUTION LAYER"

GENEVA, March 9 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2024/026833) for "RESIN COMPOSITION, AND METHOD FOR PRODUCING INTERLAYER DIELECTRIC FOR REDISTRIBUTION LAYER" on Jul 26, 2024. With publication no. WO/2025/047237, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Or...